Optical communications adapter, system and method

ABSTRACT

An optical communications adapter module is provided which includes a XENPAK-sized casing and an optical communications board assembly positioned in the casing where the optical communications board assembly has an optical transmission connector and an optical reception connector. The optical transmission connector and the optical reception connector are positioned in connector openings at a first end of the XENPAK-sized casing. The module further includes a board extender coupled to the optical communications board assembly where the board extender is capable of communicating data between the optical communications board assembly and a client computing device.

FIELD OF THE INVENTION

The present invention relates to apparatus and methods for optical datatransmission and, more particularly, to converting between opticalcommunications module formats.

BACKGROUND OF INVENTION

Optical components are modular building blocks that enable networkingand communications equipment manufacturers to create standards basedproducts to communicate data over optical data lines.

Therefore, there is a need to convert between different optical datatransmission card standards in an intelligent, cost effective manner.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention will be readily understood by thefollowing detailed description in conjunction with the accompanyingdrawings. To facilitate this description, like reference numeralsdesignate like structural elements. The invention is illustrated by wayof example and not by way of limitation in the figures of theaccompanying drawings.

FIG. 1 shows an optical communications network in accordance with oneembodiment of the present invention.

FIG. 2 shows a conversion from an XPAK module to an opticalcommunications adapter module in accordance with one embodiment of thepresent invention.

FIG. 3 shows an exploded view of an optical communications boardassembly being utilized to generate an optical communications module inaccordance with one embodiment of the present invention.

FIG. 4 shows a substantially assembled view of an optical communicationsadapter module utilizing an XPAK board assembly in accordance with oneembodiment of the present invention.

FIG. 5 illustrates an XPAK board assembly that has been electricallyconverted to fit into a XENPAK-sized casing to generate an opticaltransmission adapter module in accordance with one embodiment of thepresent invention.

FIG. 6 illustrates a side view of the optical communications adaptermodule in accordance with one embodiment of the present invention.

FIG. 7 illustrates an XFP board assembly that has been electricallyconverted to fit into a XENPAK-sized casing to generate an opticaltransmission adapter module in accordance with one embodiment of thepresent invention.

FIG. 8 illustrates a XENPAK-sized module utilizing an XFP board assemblyboard in accordance with one embodiment of the present invention.

FIG. 9 illustrates a top view of a conversion board in accordance withone embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof wherein like numeralsdesignate like parts throughout, and in which is shown by way ofillustration specific embodiments in which the invention may bepracticed. It is to be understood that other embodiments may be utilizedand structural or logical changes may be made without departing from thescope of the present invention. Therefore, the following detaileddescription is not to be taken in a limiting sense, and the scope of thepresent invention is defined by the appended claims and theirequivalents.

XENPAK (10 Gigabit Ethernet Transceiver Package), XPAK (e.g., 10 GigabitPackage but shorter than XENPAK), X2, and XFP (10 Gigabit Small FormFactor Pluggable) are different optical communications transmissionmodule standards resulting from multi-source agreements (MSA's) amongseveral manufacturers with regard to 10 Gigabit Ethernet opticaltransmission cards. XENPAK, XPAK, X2, and XFP define opticaltransceivers which conform to the 10 Gigabit Ethernet standard as statedby the IEEE (Institute of Electrical & Electronics Engineers) 802.3.

XENPAK generally utilizes SC (subscription channel) fiber opticconnectors on one end and utilizes an industry standard 70 pinelectrical connector on the other end to connect with client computingdevices to facilitate data communications to a network or any suitabletype of computing and/or telecommunications device. As known to thoseskilled in the art, an SC connector is a fiber optic connector. XENPAKmodules generally utilize a four wide XAUI (10 gigabit per secondattachment unit interface) and are configured to be hot pluggable.

The XPAK is generally a 10 gigabit hot pluggable module that providesflexible I/O and PCI compatibility. On one end, the XPAK assembly boardutilizes a standard 70 pin electrical connector to connect with clientcomputing devices to facilitate data communications with a network orother computing and/or telecommunication devices through the opticalconnectors. On the other end, the XPAK board assembly within the XPAKmodule generally utilize LC connectors to connect to other computingdevices and/or networks.

Embodiments of the present invention can enable a board assembly fromthe XPAK module to be used in a XENPAK-sized packaging unit (also knownas casing). This enhances the flexibility of optical communication cardmanufacturers because a board assembly designed to fit into a XPAKmodule can be utilized in a XENPAK-sized casing. Without using theembodiments of the present invention, the same board assembly of an XPAKmodule would create an incorrect position of the optical interface whenplaced within the XENPAK-sized casing. By use of the embodiments of thepresent invention this optical offset may be corrected and thereforesuch an offset is not present at the XENPAK-sized casing even when anXPAK board assembly is utilized.

X2 modules with X2 board assemblies are extremely similar in structureto XPAK modules. One difference between the X2 board assembly and theXPAK board assembly is that the X2 board assembly utilizes SC connectorsas opposed to LC connectors. Besides using different optical connectors,X2 and XPAK have similar functionalities and structures. Consequently,by utilizing the embodiments of the present invention, it should beappreciated that X2 board assemblies may also be utilized in aXENPAK-sized casing to generate an X2 to XENPAK adapter module.

In yet another embodiment, an XFP board assembly may be used from an XFPmodule for conversion into a XENPAK-sized module. This may beaccomplished by utilizing a board extender for the XFP board assembly toextend the XFP electrical connector.

FIG. 1 shows an optical communications network 100 in accordance withone embodiment of the present invention. In one embodiment, thecommunications network 100 includes a server 102, router 104, and a hub106 that is in communication with a network 108. It should beappreciated that the server 102, router 104, and the hub 106 areexemplary computing apparatuses (e.g., client devices, client computingdevices, etc.) that may be in optical communication with the network108. In one embodiment, the client device may include a microprocessorand a network processor coupled to one another. It should be appreciatedthat the network processor and the microprocessor may be coupled in anysuitable fashion Consequently, any suitable types and/or numbers ofcomputing or telecommunications devices may utilize an opticalcommunications adapter module 110 (e.g., XPAK board assembly toXENPAK-sized module, X2 board assembly to XENPAK-sized module, XFP boardassembly to XENPAK-sized module, etc.) described herein to communicatewith the network 108. The module 110 as described herein may be anyapparatus that may be of any suitable configuration that can facilitatedata communications utilizing an optical communications assembly boardfrom one type of optical communications device within a packaging orcasing of another optical communications device with a different sizeand/or configuration. In one embodiment, the module 110 is aXENPAK-sized module or transponder that utilizes an assembly board froma different type of optical communications module such as, for example,an XPAK assembly board, an X2 assembly board, an XFP assembly board,etc.

It should also be appreciated that the network 108 may be include anysuitable type and/or number of computing or telecommunicationsdevice(s). In one embodiment, each of the server 102, router 104, andthe hub 106 includes the adapter module 110. Although the module 110 isdepicted as being outside of the server 102, router 104, and the hub 106to show that communication with the network is facilitated by the module110, the module 110 for each of the computing devices may be containedinternally within the server 102, router 104, and the hub 106. In oneembodiment, the module 110 may connect to a bus of a computing device.Therefore, it should be appreciated that any module 110 may be connectedin any suitable fashion to the computing device as long as the opticalconnectors of the module 110 may be accessed to communicate with otherdevices. The optical communications adapter module 110 may be anysuitable device that includes one type of optical communicationsassembly board such as, for example, an XPAK board assembly, an X2 boardassembly, XFP board assembly, etc., that has been utilized to generateanother optical communications module of a different type such as, forexample, a XENPAK-sized module. It should be appreciated that a boardassembly may be any suitable card or board with circuitry or componentsthat enables computing functions such as, for example, opticalcommunications between the client computing device and externalcomputing devices and/or networks.

An XPAK board assembly may be utilized to generate a XENPAK-sized moduleby using optical conversion cords as described in further detail inreference to FIGS. 2–4.

In another embodiment, the XPAK board assembly within an XPAK module maybe utilized to generate a XENPAK-sized module using an electricalextension conversion card as described in reference to FIGS. 5 and 6. Inyet another embodiment, the optical communications adapter module 110may include an X2 board assembly coupled with optical extension cordsinserted into a XENPAK-sized module. In a further embodiment, theoptical communications adapter module 110 may include an XFP boardassembly coupled to a conversion board as described in reference toFIGS. 7–9.

FIG. 2 shows a conversion from an XPAK module 112 to an opticalcommunications adapter module 110 in accordance with one embodiment ofthe present invention. In one embodiment, the XPAK module 112 may beconverted into the optical communications adapter module 110 by placingan optical communications board assembly such as the XPAK board assemblyfrom the XPAK module 112 into a XENPAK-sized packaging unit. The XPAKmodule 112 is generally smaller than a XENPAK-sized packagingunit/casing and utilizes a different type of optical connectors. Atypical XPAK module utilizes LC optical connectors 114 and 116 while atypical XENPAK module utilizes SC optical connectors 118 and 120. Asdiscussed in further detail in reference to FIGS. 3–4, the XPAK boardassembly may be placed at a rear portion of the XENPAK-sized packagingunit and optical conversion cords may be utilized to reposition opticalconnectors of the XPAK board assembly to locations typically utilized inXENPAK-sized modules.

In addition, in one embodiment, the optical conversion cords may convertthe XPAK LC optical connectors to SC optical connectors as described infurther detail in reference to FIG. 3. Therefore, in such a conversion,the XPAK module 112 can be converted to a XENPAK-sized module in anintelligently and in a cost effective way by utilizing the XPAK boardassembly and optical conversion cords within a XENPAK-sized packagingunit.

In a further embodiment, X2 modules may be utilized to generate aXENPAK-sized module by inserting the X2 board assembly at a rear portionof the XENPAK-sized casing and coupling optical conversion cords to theX2 board assembly to reposition optical connectors of X2 boardassemblies to locations typically utilized in XENPAK-sized modules. Inthis type of embodiment, if SC connectors are desired in the opticalcommunications adapter module 110, optical extension cords may beutilized with SC connectors on both ends rather than optical conversioncords with SC connectors on one end and LC connectors on the other end(as utilized if XPAK board assemblies were being used).

In another embodiment, as discussed in reference to FIGS. 5 and 6, theXPAK module 112 can be converted to a XENPAK-sized module by utilizingan electrical conversion card to extend an XPAK card to a lengthtypically found in a XENPAK-sized module. The electrical conversion cardmay include connectors that can electrically couple with the XPAK boardassembly and communicate the electrical signals from the XPAK boardassembly to a client computing system connector. The client computingsystem connector may be any suitable connector that can communicate datato any suitable computing device or system that is configured for datatransmission and reception such as, for example, server 102, router 104,and/or hub 106.

FIG. 3 shows an exploded view of an optical communications boardassembly being utilized to generate an optical communications module inaccordance with one embodiment of the present invention. In oneembodiment, the optical communications board assembly is an XPAK boardassembly 136 positioned within a XENPAK-sized case so the electricalconnections on one end of the XPAK board assembly 136 is located at anend of the XENPAK-sized case which connects to a client computingdevice. In such an embodiment, a XENPAK-sized module is generated thatcan facilitate data communications.

In one embodiment, the XENPAK-sized case includes a top cover 130, abottom portion 134, and a face plate 138. When the XPAK board assembly136 is positioned in the aforementioned manner, the optical connectors114 and 116 of the XPAK board assembly 136 are not positioned so theconnectors 114 and 116 reach to the face plate 138. Therefore, one endof each of optical conversion cords 132 and 140 are coupled to theoptical connectors 114 and 116 respectively. The second end of each ofthe optical conversion cords 132 and 140 are positioned to be located atconnector openings in the face plate 138 where XENPAK optical connectorsfrom a XENPAK board assembly would be located.

In one embodiment, the optical conversion cords 132 and 140 may eachhave a first end that has the SC optical connector and have a second endthat has the LC optical connector. The SC optical connectors and the LCoptical connectors may be coupled to each other by fiber optics thathave the capability to communicate data. In such embodiments, theoptical conversion cords 132 and 140 may be utilized where, for example,the optical communications board assembly has LC optical connectors(e.g., XPAK board assemblies) and the SC connectors are required in theoptical communications conversion module. In one embodiment, the fiberoptics may have some lag so the fiber optics are longer than thedistance between the optical connectors 114 and 116 and the face plate138. It should be appreciated that the fiber optics coupling the SC andLC connectors may be any suitable length as long as the connectors ofthe XPAK may be extended to the location of the face plate 138.

As discussed above, for X2 assembly board to XENPAK-sized moduleconversions, an X2 board assembly from an X2 module may be utilized inthe above described conversion for XPAK modules except, in such anembodiment, the optical conversion cords 132 and 140 may have the sametype of connectors (e.g., SC connectors) on both ends because X2 PCboard assemblies typically utilize SC connectors assuming that SCconnectors are desired for the XENPAK-sized adapter module.

FIG. 4 shows a substantially assembled view of an optical communicationsadapter module 110 utilizing an XPAK board assembly 136 in accordancewith one embodiment of the present invention. In one embodiment, thecomponents as discussed in reference to FIG. 3 are assembled andpositioned into the bottom portion 134 of the XENPAK-sized case.

FIG. 5 illustrates an XPAK board assembly 136 that has been electricallyconverted to fit into a XENPAK-sized casing to generate an opticaltransmission adapter module 110′ in accordance with one embodiment ofthe present invention. In one embodiment, when the optical connectors114 and 116 of the XPAK board assembly 136 are placed in opticalconnector openings of the face plate 138 of a XENPAK-sized casing, theelectrical connector 142 does not reach to a back end of theXENPAK-sized casing and therefore, the XPAK board assembly 136 cannot beconnected to a client computing device by itself due to the sizedifferential.

In one embodiment, the electrical connector 142 of the XPAK boardassembly 136 is coupled to a receptacle interface 204. The receptacleinterface 204 may be a part of an extender board 202. The receptacleinterface 204 may be a 70 pin receptacle interface with a femaleconnector that can connect to the electrical connector 142 of the XPAKboard assembly 136 which in one embodiment, is a male 70 pin connector.The other end of the receptacle interface 204 may be a part of or may beconnectable to the extender board 202 which is configured to communicatethe electrical signals from the electrical connector 142 to anelectrical connector 142′ which, in one embodiment, has the samephysical and electrical configuration as the electrical connector 142.In one embodiment, the electrical connector 142′ has a 70 pin interface.In other embodiments, the electrical connector 142′ may be differentthan the electrical connector 142 depending on the type of connectionsthat are utilized by the client computing device to which the module isconnected.

FIG. 6 illustrates a side view of the optical communications adaptermodule 110′ in accordance with one embodiment of the present invention.The optical communications adapter in one embodiment, may be an XPAKboard assembly connected to an extender board 202 within a XENPAK-sizedadapter module as discussed above in reference to FIG. 5. In oneembodiment, the XPAK board assembly 136 is shown as the card between theface plate 138 and the interface 204. The extender board 202 may belocated between the interface 204 and the back portion of the XPAK toXENPAK-sized conversion module. The board extender may be any suitablePC card that is connectable to the interface 204 that is capable ofcommunicating data between the electrical connector 142 and theelectrical connector 142′.

In one embodiment, the extender board 202 may be a PC board with linescapable of transmitting data between the connectors 142 and 142′. Itshould be appreciated that the adapter module 110′ with the PC boardextender and the interface 204 may be utilized to make the opticalconnectors of the XPAK board assembly fit into connector openings of thefront plate of the XENPAK-sized casing.

Therefore, by using the adapter module 110′, an XPAK board assembly canbe converted into a XENPAK-sized communications module.

In one embodiment, without using optical conversion cords, the module110 may have LC connectors instead of SC connectors. Therefore, ifdesired, a XENPAK-sized communications module may be generated withoutthe SC connectors if such an embodiment is desired. In yet anotherembodiment, the adapter module with the extender board 202 may utilizean optical connector conversion cord, as discussed above in reference toFIGS. 1 through 4, to convert the LC connectors of an XPAK boardassembly to SC connectors. If an X2 board assembly has been utilized,such a conversion is not necessary if SC connectors are desired becauseas indicated above, the X2 PC board assemblies generally use SC opticalconnectors even though in most other aspects, the X2 PC board assembliesare similar to the XPAK board assemblies.

FIGS. 7 and 8 describe usage of an XFP board assembly within aXENPAK-sized casing to generate a XENPAK-sized module. As a result, thefunctionality of an XFP assembly may be applied in an intelligent andcost effective manner where XENPAK modules are often utilized. Inaddition, entities that utilize XENPAK-sized modules can use the adaptermodules 110 in their current line cards without any additionalengineering design cost or risk. Consequently, two different solutionsdo not have to be developed to two different product lines.

FIG. 7 illustrates an XFP board assembly 202 that has been electricallyconverted to fit into an XENPAK-sized casing 216 to generate an opticaltransmission adapter module 110″ in accordance with one embodiment ofthe present invention. In one embodiment, an XFP board assembly from anXFP module is placed in the XENPAK-sized casing 216. In one embodiment,the XFP board assembly may be positioned so the optical connectors areaccessible through openings in the face plate 218 of the casing 216 of aXENPAK-sized module. It should be appreciated that, depending on theconfiguration desired, the XFP board assembly 202 may also be utilizedwith the optical conversion cords to be positioned in any suitablelocation within the XENPAK-sized casing 216.

When the XFP board assembly 202 is attached to the face plate 218 of theXENPAK-sized casing 216, a board converter 205 may be utilized to extendthe data communication from the XFP board assembly 202 to a rear portionof the casing 216 where an electrical connector 208 may enable couplingand communication with a client computing device.

Generally XFP board assemblies communicate data from the opticalconnectors to a client computing device through a serial 10 G electricalsignal. XENPAK modules on the other hand communicate data from theoptical connectors. As discussed above, XENPAK modules generally utilizefour wide XAUI interface (10 gigabit per second attachment unitinterface) to communicate four lanes of data each communicating data atalmost 3 gigabits per second. Therefore, to convert the XFP electricalsignal to what XENPAK generally utilizes requires a XAUI to serial chip206. The XAUI to serial chip 206 is known to those skilled in the art.Therefore, if data communication format as typically utilized by XENPAKmodules is desired, the board converter 205 may be used to convert adata transmission type from a XFP type to XENPAK type and vice versa.The board converter 205 may utilize a XAUI to serial chip 206 to convertserial data from the XFP board assembly to a four wide XAUI datacommunication.

FIG. 8 illustrates a XENPAK-sized module utilizing an XFP board assembly202 in accordance with one embodiment of the present invention. In oneembodiment, the XFP board assembly 202 may be positioned in theXENPAK-sized casing 216 such that optical connectors 210 and 212 arelocated in optical connector openings of a face plate 218. The XFP boardassembly 202 may be connected to the conversion board 205. The XFP boardassembly 202 may have optical connectors 210 and 212 on one end and anelectrical connector 204 on a second end. In one embodiment, theelectrical connector 204 is a 30 pin electrical connector. It should beappreciated that the XFP board assembly 202 may have any suitable typeof electrical connector 204 opposite to the optical connector end. Theelectrical connector 204 may be connected to a conversion board 205through the electrical connector 204. In one embodiment, the conversionboard 205 may be an XFP to XENPAK conversion board which includes anelectrical pin receptacle which may connect with the electricalconnector 204. The XFP to XENPAK conversion board may include a XAUI toserial chip 206 that may convert the serial data communication utilizedby the XFP board assembly 202 to and from XAUI data communicationtypically utilized by XENPAK modules. The XFP to XENPAK conversion board202 may also include other circuitry like a microprocessor that maymanage the optical connectors of the XFP board assembly 202.

FIG. 9 illustrates a top view of a conversion board 205 in accordancewith one embodiment of the present invention. The conversion board 205may be configured to have a connector or a receptor that has thecapability to couple and communicate with the electrical connector onthe XFP board assembly. On the other end of the conversion board 205, anelectrical connector 208 may be configured to communicate data with aclient computing device to which the module is designed to couple with.In one embodiment, the electrical connector 208 is a 70 pin electricalconnector as is typically utilized in a XENPAK board assembly.

In one embodiment, the conversion board 205 may include the XAUI toserial chip 206. The XAUI to serial chip 206 may be any suitableintegrated circuit capable of converting XAUI data signals to serialdata signals and vice versa. Therefore, the XAUI to serial chip 206 maybe configured to communicate with the electrical connectors 208 and theXFP board assembly. In one embodiment, the conversion board 205 maycommunicate with a client computing device by using a four lane XAUIformat while the conversion board 205 may communicate with the XFPassembly board through 10 Gigabit per second serial data communications.

Another difference between data transmission between the XFP standardand the XENPAK standard is that the XFP standard generally utilizes datacommunication with a client computing device via an I2C interface asopposed to an management data input/output (MDIO) interface through the70 pin XENPAK connector. Therefore, the conversion board 205 may also beconfigured to connect with an I2C interface of the XFP assembly board onone end and also be configured to connect using an MDIO interface on theother end to connect with a client computing device.

In one embodiment, the conversion board may also include amicroprocessor 222 which may manage optical data communications of theXFP board assembly. In one embodiment, the microprocessor may assist inmanaging, monitoring, controlling, and alarming with respect to thelaser system of the XFP board assembly. In one embodiment, themicroprocessor 222 may monitor, manage, adjust, and/or generate datasignals that control the laser for the optical communications. Forexample, the microprocessor 222 may control laser on/off, bias,temperature, input power, health of optics, etc. In another embodiment,the microprocessor may assist with any necessary conversion of databetween data communication typically utilized by the XENPAK and the XFP.Therefore, the conversion board 205 may not only extend the XFP to aback portion of the XENPAK-sized casing and translate data between theXFP board assembly and the client computing device, but the conversionboard 205 may also assist in managing the operation of the XFP boardassembly.

Although specific embodiments have been illustrated and described hereinfor purposes of description of preferred embodiments, it will beappreciated by those of ordinary skill in the art that a wide variety ofalternate and/or equivalent implementations calculated to achieve thesame purposes may be substituted for the specific embodiment shown anddescribed without departing from the scope of the present invention.Those with skill in the art will readily appreciate that the presentinvention may be implemented in a very wide variety of embodiments. Thisapplication is intended to cover any adaptations or variations of theembodiments discussed herein. Therefore, it is manifestly intended thatthis invention be limited only by the claims and the equivalentsthereof.

1. An optical communications adapter module, comprising: a XENPAK-sizedcasing; an optical communications board assembly positioned in thecasing, the optical communications board assembly having an opticaltransmission connector and an optical reception connector, the opticaltransmission connector and the optical reception connector beingpositioned in connector openings at a first end of the XENPAK-sizedcasing; and a board extender coupled to the optical communications boardassembly, the board extender being capable of communicating data betweenthe optical communications board assembly and a client computing device.2. An optical communications adapter module as recited by claim 1,wherein the board extender includes an electrical connector that ispositioned at a second end of the XENPAK-sized casing.
 3. An opticalcommunications adapter module as recited by claim 2, wherein theelectrical connector is a 70 pin electrical connector.
 4. An opticalcommunications adapter module as recited by claim 1, wherein the casingincludes a bottom portion, a top cover, and a face plate.
 5. An opticalcommunications adapter module as recited by claim 1, wherein the boardextender has an interface receptacle configured to connect with anelectrical connector of the optical communications board assembly.
 6. Anoptical communications adapter module as recited by claim 1, wherein theboard extender includes electrical lines to have a capability tocommunicate data between the optical communications board assembly andthe client computing device.
 7. An optical communications adapter moduleas recited by claim 1, wherein the board extender includes an electricalconnector that is configured to be located in an electrical connectoropening of the XENPAK-sized casing.
 8. An optical communications adaptermodule as recited by claim 1, wherein the optical communications boardassembly is one of an XPAK board assembly and an X2 board assembly. 9.An optical communications system, comprising: a client computing deviceincluding a microprocessor and a network processor coupled to oneanother; and an optical communications adapter module being coupled tothe client computing device, the optical communication adapter moduleincluding a board extender and one of an XPAK board assembly and an X2board assembly housed in a XENPAK-sized module.
 10. An opticalcommunications system as recited in claim 9, wherein an electricalconnector of the one of the XPAK board assembly and the X2 boardassembly is extended to be positioned into a rear portion of the module.11. An optical communications system as recited in claim 9, wherein theelectrical connector of the one of the XPAK board assembly and the X2board assembly is extended by the board extender.
 12. An opticalcommunications system as recited in claim 11, wherein the board extenderhas an interface receptacle configured to connect with the electricalconnector of the one of the XPAK board assembly and X2 board assembly.13. An optical communications system as recited in claim 12, wherein theoptical communications adapter module is coupled to the client computingdevice through a 70 pin electrical connector.
 14. An opticalcommunications system as recited in claim 9, wherein the opticalcommunication adapter module is capable of communicating with the clientcomputing device through the one of the XPAK board assembly and the X2board assembly.
 15. An optical communications system as recited in claim9, wherein the one of the XPAK board assembly and X2 board assembly hasan optical transmission connector and an optical reception connector,the optical transmission connector and the optical reception connectorbeing positioned in connector openings of at a first end of aXENPAK-sized casing.